Femtosecond Laser Cutting and Drilling System

Specifications
Application
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Product Description
  • Point-by-point and layer-by-layer removal
  • Minimal heat-affected zone
  • Capable of processing arbitrary 2D graphics
  • Machine vision
  • Integrated system architecture with marble anti-vibration worktable, enhancing operational stability
The Roban-Drill series Femtosecond Laser Cutting and Drilling System is equipped with a high-repetition-rate femtosecond laser amplifier (optional), high-speed scanning galvanometer and field lens, as well as a high-precision positioning displacement stage. It is suitable for laboratories in research institutes and corporate R&D centers to conduct high-speed scanning cutting of hard and brittle materials, machining of blind holes, through holes, and cluster holes, and surface grooving of materials.​​ For specific customization details of this system, please contact LBTEK Technical Support.
Attribute
light sourceFemtosecond Laser Amplifier (1030 nm / 515 nm, 1-200kHz)
Processing MaterialsSapphire, quartz, silicon wafer, silicon carbide, etc.
Drilled hole diameter20 μm-20mm
Device dimensions (L×W×H)600×500×800 mm
Positioning accuracy±3 μm
Sample thickness0.1 mm-3 mm
Maximum scanning speed200 mm/s
Processing file formatAeroBasic, supports STL format conversion
Electrical RequirementsAC200-240 V,50/60 Hz,5kW
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